US 12,488,944 B2
Multilayer electronic component
Jun Oh Kim, Suwon-si (KR); Byung Kun Kim, Suwon-si (KR); Yu Hong Oh, Suwon-si (KR); and Hyun Ji Yang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 25, 2023, as Appl. No. 18/238,146.
Claims priority of application No. 10-2022-0146267 (KR), filed on Nov. 4, 2022; and application No. 10-2022-0187736 (KR), filed on Dec. 28, 2022.
Prior Publication US 2024/0153710 A1, May 9, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and an internal electrode; and
external electrodes disposed on the body,
wherein an average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.