US 12,488,933 B2
Wireless charger having thermoelectric cooler chips for dissipating heat
Tsung-Chan Wu, Hsinchu County (TW); Yen-Ming Liu, Changhua County (TW); and Chien-Hui Chen, Taoyuan (TW)
Assigned to CYNTEC CO., LTD., Hsinchu (TW)
Filed by CYNTEC CO., LTD., Hsinchu (TW)
Filed on Nov. 10, 2021, as Appl. No. 17/522,925.
Claims priority of provisional application 63/113,815, filed on Nov. 13, 2020.
Prior Publication US 2022/0158491 A1, May 19, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H02J 50/10 (2016.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01Q 7/06 (2006.01); H01Q 7/08 (2006.01); H02J 7/00 (2006.01); H02J 50/70 (2016.01); H05K 7/20 (2006.01); H10N 10/00 (2023.01)
CPC H01F 27/2823 (2013.01) [H01F 27/24 (2013.01); H01F 27/32 (2013.01); H01F 41/04 (2013.01); H01Q 7/06 (2013.01); H01Q 7/08 (2013.01); H02J 7/0044 (2013.01); H02J 50/10 (2016.02); H02J 50/70 (2016.02); H05K 7/20145 (2013.01); H10N 10/00 (2023.02)] 12 Claims
OG exemplary drawing
 
1. A wireless charger, comprising:
a top cover, comprising an insulating and heat-conducting material;
a metallic case, wherein at least one conductive element is disposed therein;
a first thermoelectric cooler chip, disposed between a bottom surface of the top cover and a top surface of the metallic case to form a first heat conductive path from the top cover to the metallic case via the first thermoelectric cooler chip for dissipating heat generated by an electronic device disposed on the top cover for wireless charging the electronic device; and
a second thermoelectric cooler chip, disposed between the bottom surface of the top cover and the top surface of the metallic case to form a second heat conductive path from the top cover to the metallic case via the second thermoelectric cooler chip for dissipating heat generated by the electronic device disposed on the top cover for wireless charging the electronic device.