US 12,488,924 B2
Magnetizing device
Toshitaka Kato, Wako (JP); Shinji Nemoto, Wako (JP); and Tokio Taira, Wako (JP)
Assigned to HONDA MOTOR CO., LTD., Tokyo (JP)
Filed by HONDA MOTOR CO., LTD., Tokyo (JP)
Filed on Feb. 13, 2024, as Appl. No. 18/439,790.
Claims priority of application No. 2023-027108 (JP), filed on Feb. 24, 2023.
Prior Publication US 2024/0290527 A1, Aug. 29, 2024
Int. Cl. H01F 13/00 (2006.01); H01F 27/06 (2006.01); H01F 27/30 (2006.01)
CPC H01F 13/00 (2013.01) [H01F 27/06 (2013.01); H01F 27/30 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A magnetizing device configured to magnetize a plurality of magnetic bodies by applying a magnetic field to a rotor including the plurality of magnetic bodies arranged in a circumferential direction, the magnetizing device comprising
at least one coil unit that generates the magnetic field,
wherein
the coil unit includes:
a support;
a coil wound around an outer circumferential surface of the support; and
a fiber reinforced resin wound around the coil to prevent deformation of the coil in a direction away from a central axis of the coil.