US 12,488,917 B2
Electronic component
Tomoya Ooshima, Nagaokakyo (JP); Yuuta Hoshino, Nagaokakyo (JP); Koichi Yamada, Nagaokakyo (JP); Miki Sasaki, Nagaokakyo (JP); and Mitsuru Nakano, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Dec. 29, 2023, as Appl. No. 18/400,627.
Application 18/400,627 is a continuation of application No. PCT/JP2022/032713, filed on Aug. 31, 2022.
Claims priority of application No. 2021-182605 (JP), filed on Nov. 9, 2021.
Prior Publication US 2024/0136093 A1, Apr. 25, 2024
Int. Cl. H01C 7/04 (2006.01); H01C 1/14 (2006.01)
CPC H01C 7/043 (2013.01) [H01C 1/1413 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a base body;
wiring inside the base body;
a glass film covering an outer surface of the base body;
an underlying electrode electrically connected to the wiring and covering a part of the glass film; and
a metal layer covering the underlying electrode,
wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm and less than a length dimension of the base body, and a boundary portion that is not covered with the underlying electrode and within 10 μm from the outer edge of the underlying electrode, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.