US 12,487,522 B2
Organometallic solution based high resolution patterning compositions and corresponding methods
Stephen T. Meyers, Corvallis, OR (US); Jeremy T. Anderson, Corvallis, OR (US); Joseph B. Edson, Corvallis, OR (US); Kai Jiang, Corvallis, OR (US); Douglas A. Keszler, Corvallis, OR (US); Michael K. Kocsis, Albany, OR (US); Alan J. Telecky, Albany, OR (US); and Brian J. Cardineau, Corvallis, OR (US)
Assigned to Inpria Corporation, Corvallis, OR (US)
Filed by Inpria Corporation, Corvallis, OR (US)
Filed on Apr. 12, 2024, as Appl. No. 18/634,119.
Application 18/634,119 is a continuation of application No. 17/705,795, filed on Mar. 28, 2022, granted, now 11,988,959.
Application 17/705,795 is a continuation of application No. 17/085,024, filed on Oct. 30, 2020, granted, now 11,500,284, issued on Nov. 15, 2022.
Application 17/085,024 is a continuation of application No. 16/674,714, filed on Nov. 5, 2019, granted, now 11,392,029, issued on Jul. 19, 2022.
Application 16/674,714 is a continuation of application No. 14/920,107, filed on Oct. 22, 2015, granted, now 10,642,153, issued on May 5, 2020.
Claims priority of provisional application 62/119,972, filed on Feb. 24, 2015.
Claims priority of provisional application 62/067,552, filed on Oct. 23, 2014.
Prior Publication US 2024/0280897 A1, Aug. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/32 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01)
CPC G03F 7/0042 (2013.01) [G03F 7/0043 (2013.01); G03F 7/2004 (2013.01); G03F 7/32 (2013.01); G03F 7/322 (2013.01); G03F 7/325 (2013.01)] 18 Claims
 
1. A radiation-sensitive structure comprising a substrate and a film supported by the substrate, the film comprising a composition having one or more Sn—C bonds and at least one Sn—O bond, wherein the film has a refractive index greater than 1.65 or an extinction coefficient greater than zero for a wavelength of equal to or less than 248 nm, and wherein the composition condenses upon absorption of radiation.