| CPC G02F 1/133614 (2021.01) [G02F 1/133603 (2013.01); G02F 1/133605 (2013.01)] | 15 Claims |

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1. A backlight module, comprising:
a light-emitting substrate, comprising a transparent substrate and a plurality of light-emitting units, wherein the plurality of light-emitting units are arranged in an array on a side of the transparent substrate;
an encapsulation layer, disposed on a side of the plurality of light-emitting units away from the transparent substrate, wherein an orthographic projection of the encapsulation layer on the transparent substrate at least covers an orthographic projection of the plurality of light-emitting units on the transparent substrate; and
a first reflective layer, disposed on a side of the encapsulation layer away from the transparent substrate, wherein an orthographic projection of the first reflective layer on the transparent substrate at least covers the orthographic projection of the plurality of light-emitting units on the transparent substrate, and wherein the first reflective layer is a Lambertian body,
wherein the encapsulation layer wraps a color conversion particle of at least one color,
wherein the backlight module further comprises a first driving layer group, and the first driving layer group comprises:
a first conductive layer, disposed on a same side of the transparent substrate as the light-emitting units, and the first conductive layer comprises a plurality of first wirings;
a first insulating layer, disposed on a side of the first conductive layer away from the transparent substrate and is located between two adjacent first wirings, and the first insulating layer is provided with a first opening for exposing the first conductive layer;
a second conductive layer, disposed on a side of the first insulating layer away from the transparent substrate, the second conductive layer comprises a plurality of second wirings, the second wirings pass through the first opening and are connected to the first wirings and are connected to the light-emitting units; and
a second insulating layer, disposed on a side of the second conductive layer away from the transparent substrate and is located between two adjacent second wirings,
wherein a portion of the first insulating layer located between two adjacent first wirings is provided with a second opening, and/or a portion of the second insulating layer located between two adjacent second wirings is provided with a third opening.
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