US 12,487,417 B2
Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit
Paul Meissner, San Jose, CA (US); Anup Pancholi, Hillsboro, OR (US); and Ronald Huemoeller, Phoenix, AZ (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 4, 2022, as Appl. No. 17/959,973.
Prior Publication US 2024/0111106 A1, Apr. 4, 2024
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4246 (2013.01) [G02B 6/4206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic and photonic device, comprising:
a substrate having an optical transceiver chip mounting region disposed over a first end of the substrate and a fiber region disposed over a second end of the substrate, wherein the substrate comprises
a plurality of optical structures,
each of the plurality of optical structures having:
a first end disposed under the optical transceiver chip mounting region to be optically connected to a respective waveguide of a plurality of waveguides of an optical transceiver chip, wherein the plurality of optical structures are configured to receive light from or transmit light to the plurality of waveguides of the optical transceiver chip which is to be disposed on the optical transceiver chip mounting region, and
a second end disposed under the fiber region to be optically connected to a respective fiber of a plurality of optical fibers to receive light from or transmit light to the plurality of optical fibers to be disposed over the fiber region.