US 12,487,255 B2
Current sensor system
Loïc André Messier, Vanzy (FR); Simon E. Rock, Heidelberg (DE); and Yannick Vuillermet, La Motte Servolex (FR)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Feb. 7, 2024, as Appl. No. 18/434,967.
Application 18/434,967 is a continuation of application No. 17/804,654, filed on May 31, 2022, granted, now 11,940,470.
Prior Publication US 2024/0210447 A1, Jun. 27, 2024
Int. Cl. G01R 15/20 (2006.01); H02K 11/27 (2016.01)
CPC G01R 15/207 (2013.01) [H02K 11/27 (2016.01); H02K 2211/03 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
one or more first conductive layers;
a plurality of second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a rift in the conductor, the rift being formed by using a plurality of through-holes that are situated above or below each other, each of the plurality of through-holes being formed in a different one of the second conductive layers, each of the plurality of through-holes being formed directly above or below a solid portion of at least one of the first conductive layers, at least two of the plurality of through-holes having different respective sizes; and
a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers,
wherein the rift is arranged to cause an area directly above the rift to have a substantially uniform magnetic coupling coefficient.