US 12,487,185 B2
Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics
Yung Hsing Chu, Zhubei (TW); Yen-Chun Chou, Taoyuan (TW); Yau-Ching Yang, Zhubei (TW); Jing Ru Hong, Zhubei (TW); and Shan-Hui Lin, Hsinchu (TW)
Assigned to GlobalWafers Co., Ltd., Hsinchu (TW)
Filed by GlobalWafers Co., Ltd., Hsinchu (TW)
Filed on Aug. 8, 2022, as Appl. No. 17/818,131.
Claims priority of provisional application 63/260,295, filed on Aug. 16, 2021.
Prior Publication US 2023/0047412 A1, Feb. 16, 2023
Int. Cl. H01L 21/304 (2006.01); B24B 9/06 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01)
CPC G01N 21/8851 (2013.01) [B24B 9/065 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); G01N 2021/8861 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for processing semiconductor wafers, the method comprising:
providing a first semiconductor wafer processed by a front-end process tool;
obtaining measurement data of an edge profile of the first semiconductor wafer;
determining an edge profile center point based on the measurement data;
generating a raw height profile based on the measurement data and the edge profile center point;
generating an ideal edge profile based on polynomial regression of the raw height profile;
generating a Gapi edge profile of the first semiconductor wafer based on the raw height profile and the ideal edge profile;
calculating a Gapi edge value of the first semiconductor wafer based on the Gapi edge profile;
determining whether the Gapi edge value of the first semiconductor wafer is within a predetermined threshold;
if the Gapi edge value of the first semiconductor wafer is not within the predetermined threshold:
tuning the front-end process tool based on the Gapi edge profile of the first semiconductor wafer; and
processing a second semiconductor wafer with the tuned front-end process tool; and
if the Gapi edge value of the first semiconductor wafer is within the predetermined threshold, sorting the first semiconductor wafer for polishing.