US 12,487,139 B2
Modular sensor designs and applications thereof
Nicola Molinazzi, Kfar Sava (IL); and Tsvi Shmilovich, Pardes Hanna-Karkur (IL)
Assigned to EZMEMS LTD., Caesarea (IL)
Appl. No. 18/270,695
Filed by EZMEMS LTD., Caesarea (IL)
PCT Filed Jan. 5, 2022, PCT No. PCT/IL2022/050017
§ 371(c)(1), (2) Date Jun. 30, 2023,
PCT Pub. No. WO2022/149128, PCT Pub. Date Jul. 14, 2022.
Claims priority of provisional application 63/134,013, filed on Jan. 5, 2021.
Prior Publication US 2024/0077376 A1, Mar. 7, 2024
Int. Cl. G01L 19/00 (2006.01); G01L 19/08 (2006.01); G01L 19/14 (2006.01)
CPC G01L 19/0092 (2013.01) [G01L 19/083 (2013.01); G01L 19/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A modular sensor device comprising:
an embeddable sensor module configured to directly integrate into a product or device, or a technical element thereof, by plastic integration, providing in situ sensing therein at least one property or condition associated with said product or device, or with a substance contained, processed or streamed therethrough, wherein said embeddable sensor module:
includes one or more sensor elements configured to sense the at least one property or condition and circuitry that generates measurement data/signals indicative of said at least one property or condition, and transmits the generated measurement data/signals to a device located external to said product or device, and
is configured to be powered and activated by signals received from the external device.