US 12,487,110 B2
Sensor module
Vikram Venkatadri, Ayer, MA (US); and David Frank Bolognia, Charlestown, MA (US)
Assigned to Analog Devices, Inc., Wilmington, MA (US)
Appl. No. 18/247,987
Filed by ANALOG DEVICES, INC.
PCT Filed Oct. 27, 2021, PCT No. PCT/US2021/056871
§ 371(c)(1), (2) Date Apr. 5, 2023,
PCT Pub. No. WO2022/093972, PCT Pub. Date May 5, 2022.
Claims priority of provisional application 63/108,127, filed on Oct. 30, 2020.
Prior Publication US 2023/0384137 A1, Nov. 30, 2023
Int. Cl. G01F 11/02 (2006.01); A61M 5/315 (2006.01); G01F 23/263 (2022.01)
CPC G01F 11/027 (2013.01) [A61M 5/31511 (2013.01); G01F 23/263 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A sensor module comprising:
a housing body disposed about a cavity sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module;
a first electrode coupled to or formed with the housing body, the first electrode disposed at a first peripheral position on the housing body;
a second electrode coupled to or formed with the housing body, the second electrode disposed at a second peripheral position on the housing body that is opposite the first peripheral position, the cavity disposed between the first and second electrodes in the operational configuration of the housing body; and
at least one substrate coupled to the housing body and comprising a plurality of conductive layers at least partially embedded in an insulating material of the substrate, the plurality of conductive layers including:
a first layer at a radially inner portion of the at least one substrate,
a second layer disposed radially outward from the first layer, and
a third layer disposed radially outward from the second layer, the third layer comprising first and second outer shields disposed radially opposite one another.