US 12,486,979 B2
Flare tips
John W. Olver, Blacksburg, VA (US); and Garabit Jack Sarkis, Beirut (LB)
Appl. No. 17/753,970
Filed by John W. Olver, Blacksburg, VA (US); Garabit Jack Sarkis, Beirut (LB); Emisshield Inc., Blacksburg, VA (US); and Desert World Company, Khobar (SA)
PCT Filed Sep. 18, 2020, PCT No. PCT/US2020/051586
§ 371(c)(1), (2) Date Mar. 18, 2022,
PCT Pub. No. WO2021/055813, PCT Pub. Date Mar. 25, 2021.
Claims priority of provisional application 62/902,384, filed on Sep. 18, 2019.
Prior Publication US 2022/0373177 A1, Nov. 24, 2022
Int. Cl. F23G 7/08 (2006.01); F23D 14/76 (2006.01)
CPC F23G 7/085 (2013.01) [F23D 14/76 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A flare tip (12) for optimizing a thermal paradigm to reduce temperature adjacent the flare tip (12), comprising:
a center flare tip assembly (16) having first inner and first outer surfaces, a plenum flare tip assembly (18) having second inner and second outer surfaces encompassing the center flare tip assembly (16), and arms (20) having at least an third outer surface and extending from the center flare tip assembly (16) to the plenum flare tip assembly (18), wherein
the center flare tip assembly (16), the plenum flare tip assembly (18) and arms (20) are composed of metallic structures;
the inner surfaces defining an interior space extending from a first end to a second end allowing fluid gas communication therethrough;
the first outer surface of the center flare tip assembly (16) has a high emissivity thermal layer (14), both the second inner and second outer surfaces of the plenum flare tip assembly (18) are covered by a high emissivity thermal layer (14), the third outer surface of the arms (20) are covered with a high emissivity thermal layer (14), or any surface of the flare tip (12) have a high emissivity thermal layer (14) thereon, or combinations thereof;
a high emissivity thermal layer (14) disposed on either the first inner surface, or first outer surface, or second inner surface, or second outer surface, or third outer surface or combinations thereof; wherein
the high emissivity thermal layer (14) contains
from about 5% to about 30% of an inorganic adhesive, from about 45% to about 92% of a filler, and from about 1% to about 20% of one or more emissivity agents; or
from about 5% to about 35% of colloidal silica, colloidal alumina, or combinations thereof; from about 23% to about 79% of a filler, from about 1% to about 25% of one or more emissivity agents.