US 12,486,967 B2
Light-emitting diode (LED) luminaire assembly and methods
Poonam Chavan, Satara (IN); Ajay Chidambaram Pillai Swornalatha, Kanyakumari District (IN); and Ravi Shankar Panday, Lucknow (IN)
Assigned to Eaton Intelligent Power Limited, Dublin (IE)
Filed by Eaton Intelligent Power Limited, Dublin (IE)
Filed on Aug. 4, 2023, as Appl. No. 18/365,884.
Application 18/365,884 is a continuation of application No. 17/499,191, filed on Oct. 12, 2021, granted, now 11,774,070.
Claims priority of provisional application 63/090,393, filed on Oct. 12, 2020.
Prior Publication US 2023/0375161 A1, Nov. 23, 2023
Int. Cl. F21V 15/01 (2006.01); F21V 3/06 (2018.01); F21V 29/83 (2015.01); F21Y 115/10 (2016.01)
CPC F21V 15/01 (2013.01) [F21V 3/061 (2018.02); F21V 29/83 (2015.01); F21Y 2115/10 (2016.08)] 20 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) luminaire assembly, comprising:
a mounting module comprising a first side and a second side opposite the first side;
an LED assembly mounted on a baseplate mechanically coupled to the mounting module at the second side of the mounting module; and
a driver mounted on a driver plate and configured to provide electricity to the LED assembly, wherein the driver plate is mechanically coupled to the mounting module at the first side, and further wherein the driver plate is thermally coupled to the mounting module to dissipate heat to the mounting module;
wherein the baseplate includes one or more reduced thickness sections along a path of thermal conduction between the LED assembly and the mounting module to decrease conductive heat transfer between the LED assembly and the driver,
wherein the mounting module, the baseplate, and the driver plate define a cavity configured to provide thermal separation between the driver and the LED assembly.