US 12,486,590 B2
Substrate processing method
Meng Wu, Shanghai (CN); Chenhua Lu, Shanghai (CN); Zhaowei Jia, Shanghai (CN); Quan Cao, Shanghai (CN); Jian Wang, Shanghai (CN); and Hui Wang, Shanghai (CN)
Assigned to ACM RESEARCH (SHANGHAI), INC., Shanghai (CN)
Appl. No. 18/690,685
Filed by ACM RESEARCH (SHANGHAI), INC., Shanghai (CN)
PCT Filed Jul. 25, 2022, PCT No. PCT/CN2022/107507
§ 371(c)(1), (2) Date Mar. 8, 2024,
PCT Pub. No. WO2023/035790, PCT Pub. Date Mar. 16, 2023.
Claims priority of application No. 202111050183.4 (CN), filed on Sep. 8, 2021.
Prior Publication US 2024/0376625 A1, Nov. 14, 2024
Int. Cl. C25D 5/34 (2006.01); C25D 5/10 (2006.01); C25D 5/54 (2006.01); C25D 17/06 (2006.01); H01L 21/288 (2006.01)
CPC C25D 5/34 (2013.01) [C25D 5/10 (2013.01); C25D 5/54 (2013.01); C25D 17/06 (2013.01); H01L 21/288 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate processing method, comprising:
S1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber;
S2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate;
S3: electroplating a second metal layer on the first metal layer.