US 12,486,577 B2
Pulsed plasma (DC/RF) deposition of high quality C films for patterning
Eswaranand Venkatasubramanian, Santa Clara, CA (US); Yang Yang, Santa Clara, CA (US); Pramit Manna, Santa Clara, CA (US); Kartik Ramaswamy, San Jose, CA (US); Takehito Koshizawa, San Jose, CA (US); and Abhijit B. Mallick, Fremont, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 9, 2023, as Appl. No. 18/119,406.
Application 18/119,406 is a division of application No. 16/982,955, granted, now 11,603,591, issued on Mar. 14, 2023, previously published as PCT/US2018/056004, filed on Oct. 16, 2018.
Claims priority of provisional application 62/666,205, filed on May 3, 2018.
Prior Publication US 2023/0220551 A1, Jul. 13, 2023
Int. Cl. B32B 9/00 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/503 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01)
CPC C23C 16/503 (2013.01) [C23C 16/45502 (2013.01); C23C 16/4586 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); H01L 21/02115 (2013.01); H01L 21/02274 (2013.01); H01L 21/02521 (2013.01); H01L 21/02527 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A carbon hardmask, comprising:
an amorphous carbon layer disposed on a surface of a substrate, the amorphous carbon layer has a density of more than about 1.8 g/cm3, a Young's modulus of more than about 150 GPa, a film stress of less than about 500 MPa, the amorphous carbon layer having a plurality of openings formed therethrough, each of the each of the plurality of openings have a height to width ratio of more than about 10:1, the substrate comprises one or more material layers, the amorphous carbon layer has a thickness between about 10 kÅ and about 30 KÅ, and the amorphous carbon layer having a greater sp3 carbon fraction than a sp2 carbon fraction.