| CPC C23C 16/4585 (2013.01) [C23C 16/06 (2013.01); C23C 16/50 (2013.01); H01J 37/32715 (2013.01); H01L 21/68721 (2013.01); H01L 21/68742 (2013.01); H01L 21/76843 (2013.01); H01L 21/76876 (2013.01); H01L 21/76879 (2013.01); H01L 23/53266 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/332 (2013.01)] | 19 Claims |

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9. A process chamber for substrate processing, comprising:
a chamber body comprising a lower wall;
a substrate support assembly disposed within the chamber body, the substrate support assembly comprising:
a substrate support;
a purge ring defining a radially outward edge of the substrate support;
a plurality of substrate lift pins disposed through the substrate support and radially inward of the purge ring; and
a shadow ring lift assembly, the shadow ring lift assembly configured to raise and lower a shadow ring positioned around the purge ring of the substrate support, the shadow ring lift assembly comprising:
a lift hoop configured to support the plurality of substrate lift pins;
a shadow ring lift arm disposed away from the lower wall, while in a raised position;
a plurality of lift pin housings coupled to the plurality of substrate lift pins;
a shadow ring lift plate coupled to the plurality of lift pin housings; and
a plurality of shadow ring lift pins disposed radially outward of the substrate support, the plurality of substrate lift pins, and the lift hoop.
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