US 12,486,575 B2
Apparatus for processing substrate, gas shower head, and method for processing substrate
Hirokazu Ueda, Osaka (JP); Naoki Umeshita, Tokyo (JP); Toshikazu Akimoto, Tokyo (JP); and Hiroki Maehara, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Sep. 27, 2022, as Appl. No. 17/954,105.
Claims priority of application No. 2021-158198 (JP), filed on Sep. 28, 2021.
Prior Publication US 2023/0094546 A1, Mar. 30, 2023
Int. Cl. C23C 16/455 (2006.01); B05C 11/10 (2006.01); C23C 16/40 (2006.01); C23C 16/52 (2006.01); C23C 16/458 (2006.01)
CPC C23C 16/45565 (2013.01) [B05C 11/1013 (2013.01); C23C 16/402 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); C23C 16/4583 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate by supplying a processing gas to the substrate provided in a processing space in a processing container, the apparatus comprising:
a mounting table provided in the processing container and configured to mount the substrate;
a gas shower head comprising a gas diffusion space provided at a position facing the mounting table and configured to diffuse the processing gas, and a shower plate having a plurality of gas supply holes for supplying the processing gas diffused in the gas diffusion space to the processing space;
a gas supply portion provided to supply the processing gas to the gas diffusion space and having a flow rate adjusting portion for the processing gas;
a pressure sensor portion disposed inside of the gas diffusion space and configured to output a pressure signal corresponding to a pressure measurement value in the gas diffusion space; and
a controller configured to output a control signal for adjusting a flow rate of the processing gas to the flow rate adjusting portion based on the pressure measurement value acquired by the pressure sensor portion through the pressure signal,
wherein the gas shower head comprises a plurality of the gas diffusion spaces partitioned from each other by partition walls,
the pressure sensor portion comprises a plurality of pressure sensors provided on the partition walls and each of the pressure sensors is disposed inside of a respective one of the plurality of the gas diffusion spaces,
each of the gas diffusion spaces has the gas supply holes for supplying the processing gas diffused in each gas diffusion space to the processing space,
the gas supply portion comprises a plurality of the flow rate adjusting portions for adjusting the flow rate of each of the processing gases supplied to the plurality of the gas diffusion spaces, and
the controller outputs the control signal to the flow rate adjusting portion for adjusting the flow rate of the processing gas supplied to the gas diffusion space provided with each of the pressure sensors based on the pressure measurement values acquired from the plurality of the pressure sensors.