US 12,486,566 B2
Physical vapor deposition chamber with target surface morphology monitor
Hai-Dang Trinh, Hsinchu (TW); Chii-Ming Wu, Taipei (TW); and Shing-Chyang Pan, Jhudong Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Jul. 18, 2022, as Appl. No. 17/866,972.
Application 17/866,972 is a division of application No. 16/429,187, filed on Jun. 3, 2019, granted, now 11,479,849.
Prior Publication US 2022/0349045 A1, Nov. 3, 2022
Int. Cl. C23C 14/54 (2006.01); C23C 14/35 (2006.01); G06N 20/00 (2019.01)
CPC C23C 14/54 (2013.01) [C23C 14/35 (2013.01); G06N 20/00 (2019.01)] 20 Claims
OG exemplary drawing
 
1. A method of controlling a sputtering system, the method comprising:
monitoring a topography of a surface of a sputtering target using one or more time of flight cameras;
progressively modifying a deposition process parameter in relation to changes in the topography, wherein the deposition process parameter is one of a process duration, a pressure, a magnet position, a voltage for a power source, a frequency for a power source, a gas flow rate, a capacitance of a variable capacitor, or a temperature;
operating the sputtering system using the modified deposition process parameter;
wherein the one or more time of flight cameras comprise a plurality of time of flight cameras, each held at a distinct fixed location within a vacuum chamber of the sputtering system, and the method further comprises:
shielding the plurality of time of flight cameras from the sputtering target using a plurality of first substrates, wherein respective ones of the plurality of first substrates shield respective ones of the plurality of time of flight cameras;
removing the plurality of first substrates from the sputtering system;
placing a plurality of second substrates in the sputtering system; and
operating the sputtering system using the deposition process parameter while the plurality of second substrates shield the plurality of time of flight cameras from the sputtering target.