US 12,486,120 B2
Substrate processing system carrier
Aaron Green, Sunnyvale (CA); Nicholas Michael Bergantz, Sunnyvale, CA (US); Damon K. Cox, Jarrell, TX (US); and Andreas Schmid, Meyriez (CH)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 18, 2021, as Appl. No. 17/205,878.
Claims priority of provisional application 62/993,528, filed on Mar. 23, 2020.
Prior Publication US 2021/0292104 A1, Sep. 23, 2021
Int. Cl. B65G 47/90 (2006.01); B25J 15/08 (2006.01)
CPC B65G 47/90 (2013.01) [B25J 15/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A carrier comprising:
a rigid body forming a plurality of openings extending completely through the rigid body from an upper surface of the rigid body to a lower surface of the rigid body and offset from a perimeter of the rigid body; and
a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings, wherein:
a first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings to extend outwardly from the perimeter of the rigid body, the first set of fingers being configured to support a first content substantially parallel to the upper surface of the rigid body during first transportation of the carrier within a substrate processing system; and
a second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings to extend outwardly from the perimeter of the rigid body responsive to the plurality of fasteners being removed from the first set of fingers and the plurality of openings and the first set of fingers not being attached to the rigid body, the second set of fingers being configured to support a second content substantially parallel to the upper surface of the rigid body during second transportation of the carrier within the substrate processing system.