US 12,486,095 B2
Electronic device and packing structure
Hidefumi Minemura, Shiojiri (JP); and Haruki Miyasaka, Matsumoto (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 7, 2023, as Appl. No. 18/179,997.
Claims priority of application No. 2022-035027 (JP), filed on Mar. 8, 2022.
Prior Publication US 2023/0286725 A1, Sep. 14, 2023
Int. Cl. B65D 81/113 (2006.01); B65D 77/02 (2006.01); B65D 81/05 (2006.01); B65D 85/68 (2006.01); H05K 5/02 (2006.01)
CPC B65D 81/113 (2013.01) [B65D 77/02 (2013.01); B65D 81/057 (2013.01); B65D 85/68 (2013.01); H05K 5/0217 (2013.01); H05K 5/0234 (2013.01); B65D 2585/689 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic device, comprising
a rib provided at an outer surface of a device main body, the rib being configured to come into contact, via an accommodation bag, with a packing material having a core, wherein
the rib is configured to extend in a direction intersecting a first direction in which the core extends.