US 12,486,069 B2
Condiment packaging
Ryan Gilmore, Columbus, OH (US)
Assigned to Tamaripak, LLC, Columbus, OH (US)
Filed by Tamaripak, LLC, Columbus, OH (US)
Filed on May 8, 2023, as Appl. No. 18/144,597.
Claims priority of provisional application 63/439,206, filed on Jan. 16, 2023.
Prior Publication US 2024/0239547 A1, Jul. 18, 2024
Int. Cl. B65D 1/36 (2006.01); B65D 25/20 (2006.01); B65D 43/02 (2006.01); B65D 77/20 (2006.01)
CPC B65D 1/36 (2013.01) [B65D 25/20 (2013.01); B65D 43/0202 (2013.01); B65D 77/20 (2013.01); B65D 2543/00194 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A condiment packaging, comprising:
a condiment receptacle having an upper planar portion and four sidewalls in a rectangular arrangement, that extend downwards, substantially transverse relative to the upper planar portion, defining a hollow area containing about a half ounce of soy sauce and a top-side opening into the hollow area, the top-side opening having an area ranging from about 1.56 inches2 to about 4.38 inches2 and the hollow area having a depth ranging from about 0.75 inches to about 1.25 inches;
a condiment reservoir attached to said receptacle, said reservoir having a hollow area containing wasabi and a top-side opening into the hollow area, the hollow area having a depth that is less than the depth of the hollow area of the condiment receptacle; and
at least one peelable top adapted to fit over and seal the openings of said receptacle and said reservoir.