US 12,156,385 B2
Electronic assembly
Rene Kloetzig, Reutlingen (DE); and Thomas Maerz, Metzingen (DE)
Assigned to Robert Bosch GmbH, Stuttgart (DE)
Appl. No. 18/013,084
Filed by Robert Bosch GmbH, Stuttgart (DE)
PCT Filed Jun. 9, 2021, PCT No. PCT/EP2021/065465
§ 371(c)(1), (2) Date Dec. 27, 2022,
PCT Pub. No. WO2021/259639, PCT Pub. Date Dec. 30, 2021.
Claims priority of application No. 10 2020 207 871.8 (DE), filed on Jun. 25, 2020.
Prior Publication US 2023/0255004 A1, Aug. 10, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 5/00 (2006.01); H01R 12/58 (2011.01)
CPC H05K 7/20845 (2013.01) [H05K 5/0069 (2013.01); H01R 12/58 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic arrangement, comprising:
a base plate (2),
an electronic component (3) having a plurality of pins (30), which each extend parallel to a press-in axis (4),
a printed circuit board (5), which is pressed onto the pins (30) along the press-in axis (4),
a cooling region (6), which is formed between the electronic component (3) and the base plate (2), and
a seal arrangement (7), which is arranged between the base plate (2) and the electronic component (3) and is configured to seal the cooling region (6),
wherein the seal arrangement (7) has a seal carrier (71) and at least one seal (72),
wherein the seal carrier (71) has a plurality of press-in domes (75) protruding parallel to the press-in axis (4), and
wherein the electronic component (3) is supported by the press-in domes (75) of the seal carrier (71) to absorb a press-on force (4) when the printed circuit board (5) is pressed onto the pins (30).