| CPC H05K 7/20409 (2013.01) [G06F 1/20 (2013.01); H05K 7/2039 (2013.01)] | 17 Claims |
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1. A semiconductor storage device comprising:
a housing;
a board in the housing;
a semiconductor memory component on the board;
a controller on the board, the controller being configured to control the semiconductor memory component; and
a heat-dissipation structure on the housing, the heat-dissipation structure being exposed to an outside of the housing, wherein
the housing has a first region and a second region, the first region overlaps the semiconductor memory component in a first direction, the first direction being a thickness direction of the board, the second region overlaps the controller in the first direction,
the heat-dissipation structure includes a plurality of first heat-dissipation fins, a plurality of second heat-dissipation fins, and a first cover portion,
the plurality of the first heat-dissipation fins are on the first region,
each of the plurality of the first heat-dissipation fins extends in a second direction, the second direction being a direction from the semiconductor memory component to the controller,
the plurality of the second heat-dissipation fins are on the second region,
the plurality of the second heat-dissipation fins are apart from the plurality of the first heat-dissipation fins in the second direction,
each of the plurality of the second heat-dissipation fins extends in the second direction,
the first cover portion is between the plurality of the first heat-dissipation fins and the plurality of the second heat-dissipation fins, or the first cover portion is at a gap between the second heat-dissipation fins, and
the first cover portion covers at least a part of the gap between the second heat-dissipation fins when viewed from the second direction.
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