US 12,156,347 B2
Jig for via-hole processing, via-hole processing device, and via-hole processing method using same
Jong Heum Yoon, Seoul (KR); Jee Hee Lim, Seoul (KR); Hong Ik Kim, Seoul (KR); and Se Woong Na, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/296,011
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Nov. 14, 2019, PCT No. PCT/KR2019/015538
§ 371(c)(1), (2) Date May 21, 2021,
PCT Pub. No. WO2020/105957, PCT Pub. Date May 28, 2020.
Claims priority of application No. 10-2018-0144644 (KR), filed on Nov. 21, 2018; application No. 10-2018-0144670 (KR), filed on Nov. 21, 2018; and application No. 10-2018-0144698 (KR), filed on Nov. 21, 2018.
Prior Publication US 2022/0015245 A1, Jan. 13, 2022
Int. Cl. H05K 3/40 (2006.01); B23K 26/38 (2014.01); B23K 26/382 (2014.01); H05K 3/00 (2006.01)
CPC H05K 3/4038 (2013.01) [B23K 26/382 (2015.10); H05K 3/0026 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A jig for processing a via hole comprising:
an auxiliary member having a plate shape disposed between a processing plate in which a suction portion is disposed at a lower portion and a workpiece,
wherein a plurality of first suction holes for sucking and supporting the workpiece by suction provided through the suction portion are formed in the auxiliary member,
wherein each of the plurality of first suction holes comprises:
a first hole portion extending in a first direction, and
a second hole portion extending in a second direction different from the first direction,
wherein the first direction is perpendicular to the second direction.