US 12,156,339 B2
Camera module
Suk Ho Kim, Seoul (KR); Sang Hyuck Nam, Seoul (KR); and Seok Jun Hong, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 18/021,974
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Aug. 17, 2021, PCT No. PCT/KR2021/010881
§ 371(c)(1), (2) Date Feb. 17, 2023,
PCT Pub. No. WO2022/039472, PCT Pub. Date Feb. 24, 2022.
Claims priority of application No. 10-2020-0104721 (KR), filed on Aug. 20, 2020.
Prior Publication US 2023/0309235 A1, Sep. 28, 2023
Int. Cl. H05K 1/18 (2006.01); G02B 5/20 (2006.01); G02B 7/02 (2021.01); H04N 25/20 (2023.01); H04N 25/77 (2023.01)
CPC H05K 1/182 (2013.01) [H04N 25/20 (2023.01); H04N 25/77 (2023.01); G02B 5/208 (2013.01); G02B 7/021 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10984 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A camera module, comprising:
an image sensor;
a circuit board disposed on the image sensor; and
an infrared filter disposed on the circuit board,
wherein the circuit board includes:
an insulating layer including a cavity overlapping each of at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and
a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and
wherein a planar shape of the cavity is different from a planar shape of the image sensor.