	US 12,156,337 B2
	Wiring board and method for manufacturing wiring board
Seiji Take, Tokyo (JP); Shuji Kawaguchi, Tokyo (JP); and Chiaki Hatsuta, Tokyo (JP)
Assigned to Dai Nippon Printing Co., Ltd., Tokyo (JP)
Appl. No. 17/996,805
Filed by Dai Nippon Printing Co., Ltd., Tokyo (JP)
PCT Filed Apr. 28, 2021, PCT No. PCT/JP2021/017032 § 371(c)(1), (2) Date Oct. 21, 2022, PCT Pub. No. WO2021/221119, PCT Pub. Date Nov. 4, 2021.
Claims priority of application No. 2020-081050 (JP), filed on May 1, 2020.
Prior Publication US 2023/0062683 A1, Mar. 2, 2023
Int. Cl. H05K 1/02 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)

CPC H05K 1/181 (2013.01) [H01Q 1/364 (2013.01); H01Q 1/38 (2013.01); H05K 1/0274 (2013.01); H05K 3/303 (2013.01); H05K 2201/10098 (2013.01)]

18 Claims

1. A wiring board comprising:

a substrate; and

a mesh wiring layer disposed on the substrate and including a plurality of wiring lines,

wherein the substrate has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less,

wherein the wiring lines have a surface roughness Ra, and the surface roughness Ra is 100 nm or less, and

wherein the wiring lines comprise metal crystals, and an area average grain size of the metal crystals is 300 nm or more.