| CPC H03H 9/542 (2013.01) [H03H 3/02 (2013.01); H03H 9/0561 (2013.01); H10N 30/071 (2023.02)] | 30 Claims |
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1. A radio frequency (RF) filter, comprising:
an acoustic die;
a lower mold formed on sides and upper surface of the acoustic die, the lower mold covering an acoustic dome of the acoustic die, the lower mold having one or more lower mold via holes that expose one or more bond pads of the acoustic die;
one or more lower conductors formed on the lower mold and in the one or more lower mold via holes to electrically couple with the one or more bond pads; and
one or more inductors formed in one or more layers above the lower mold, the one or more inductors being electrically coupled to the acoustic die through the one or more lower conductors and the one or more bond pads such that an electrical signal is filtered through the acoustic die and the one or more inductors.
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