US 12,155,372 B2
Multi-filter die
Georgios Dogiamis, Chandler, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); Feras Eid, Chandler, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 7, 2022, as Appl. No. 17/688,065.
Application 17/688,065 is a continuation of application No. 16/707,497, filed on Dec. 9, 2019, granted, now 11,316,497.
Prior Publication US 2022/0190806 A1, Jun. 16, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/54 (2006.01); H03H 9/02 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/54 (2013.01) [H03H 9/02574 (2013.01); H03H 9/02913 (2013.01); H03H 9/6483 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave resonator (AWR) die comprising:
a die body comprising a first layer and a second layer neighboring the first layer; and
a filter in the die body,
wherein the filter comprises a piezoelectric layer positioned at an interface of the first layer and the second layer, a portion of the piezoelectric layer is in the first layer, another portion of the piezoelectric layer is in the second layer, and the piezoelectric layer is suspended between a cavity formed in the first layer and a cavity formed in the second layer.