US 12,155,133 B2
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
Feras Eid, Chandler, AZ (US); Sasha N. Oster, Marion, IA (US); Telesphor Kamgaing, Chandler, AZ (US); Georgios C. Dogiamis, Chandler, AZ (US); and Aleksandar Aleksov, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 11, 2023, as Appl. No. 18/133,361.
Application 18/133,361 is a continuation of application No. 17/317,332, filed on May 11, 2021, granted, now 11,658,418.
Application 17/317,332 is a continuation of application No. 16/345,171, granted, now 11,050,155, issued on Jun. 29, 2021, previously published as PCT/US2016/066717, filed on Dec. 14, 2016.
Prior Publication US 2023/0246338 A1, Aug. 3, 2023
Int. Cl. H01Q 1/38 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/52 (2006.01); H01Q 9/04 (2006.01); H01Q 19/22 (2006.01); H01L 23/367 (2006.01)
CPC H01Q 9/0414 (2013.01) [H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/241 (2013.01); H01Q 1/526 (2013.01); H01Q 19/22 (2013.01); H01L 23/3675 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic device, comprising:
a package substrate;
a die coupled to a top side of the package substrate;
a main patch in the top surface of the package substrate; and
a mold material having a first portion laterally adjacent to the die and a second portion over the main patch, the first portion of the mold material having a first thickness, and the second portion of the mold material having a second thickness, the second thickness greater than the first thickness.