US 12,155,111 B2
Electronic package
Chung Ju Yu, Kaohsiung (TW); Shao-Lun Yang, Kaohsiung (TW); Chun-Hung Yeh, Kaohsiung (TW); Hong Jie Chen, Kaohsiung (TW); Tsung-Wei Lu, Kaohsiung (TW); and Wei Shuen Kao, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 30, 2021, as Appl. No. 17/566,573.
Prior Publication US 2023/0216174 A1, Jul. 6, 2023
Int. Cl. H01L 23/66 (2006.01); H01L 21/56 (2006.01); H01L 23/06 (2006.01); H01L 23/31 (2006.01); H01Q 1/22 (2006.01); H01Q 13/18 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/561 (2013.01); H01L 23/06 (2013.01); H01L 23/3128 (2013.01); H01L 2223/6677 (2013.01); H01Q 13/18 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a carrier having a first surface and a second surface;
an antenna substrate comprising a resonant cavity and disposed over the first surface, the antenna substrate being closer to the first surface than the second surface of the carrier;
an electronic component disposed between the antenna substrate and the second surface of the carrier, wherein the electronic component is disposed between the carrier and the antenna substrate; and
an encapsulant encapsulating the electronic component, wherein a portion of the carrier is embedded within the encapsulant.