US 12,155,027 B2
Display device including a pad unit connected to a pixel
Jin Yeong Kim, Yongin-si (KR); Mi Jin Park, Yongin-si (KR); Sang Ho Park, Yongin-si (KR); Tae Hoon Yang, Yongin-si (KR); and Sung Jin Lee, Yongin-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Dec. 18, 2023, as Appl. No. 18/544,371.
Application 18/544,371 is a continuation of application No. 17/867,627, filed on Jul. 18, 2022, granted, now 11,848,409.
Application 17/867,627 is a continuation of application No. 16/927,758, filed on Jul. 13, 2020, granted, now 11,393,964, issued on Jul. 19, 2022.
Claims priority of application No. 10-2019-0127760 (KR), filed on Oct. 15, 2019.
Prior Publication US 2024/0120454 A1, Apr. 11, 2024
Int. Cl. H01L 33/62 (2010.01); G09G 3/32 (2016.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 59/131 (2023.01); H10K 59/179 (2023.01); G09G 3/20 (2006.01)
CPC H01L 33/62 (2013.01) [G09G 3/32 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H10K 59/12 (2023.02); H10K 59/122 (2023.02); H10K 59/131 (2023.02); H10K 59/179 (2023.02); G09G 3/2003 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0439 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A display device comprising:
a substrate including a display area and a non-display area;
a pixel located in the display area;
a pad unit located on one side of the non-display area; and
a driver connected to the pixel through the pad unit,
wherein the pad unit comprises:
a pad metal layer;
a first pad insulating layer on the pad metal layer, and comprising a first pad opening portion exposing at least a portion of the pad metal layer;
a second pad insulating layer on the first pad insulating layer, and comprising a second pad opening portion entirely overlapping the pad metal layer; and
a pad electrode on the first pad insulating layer, and being in contact with the pad metal layer through the first pad opening portion and the second pad opening portion.