| CPC H01L 33/62 (2013.01) [H01L 33/50 (2013.01); H01L 33/52 (2013.01)] | 16 Claims |
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1. An electronic device, comprising:
a first substrate having a first surface, a second surface and a first side surface, wherein the second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface;
a circuit layer disposed on the first surface of the first substrate;
a conductive wire electrically connected to the circuit layer;
an adhesive layer disposed on the first surface and the circuit layer, wherein the adhesive layer has a second side surface, a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer; and
a second substrate disposed on the circuit layer, wherein the second substrate has a third side surface,
wherein the first portion of the conductive wire contacts the third side surface of the second substrate.
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