US 12,154,956 B1
Structure including multi-level field plate and method of forming the structure
Johnatan Avraham Kantarovsky, South Burlington, VT (US); Rajendran Krishnasamy, Essex Junction, VT (US); Mark D. Levy, Williston, VT (US); John J. Ellis-Monaghan, Grand Isle, VT (US); Michael J. Zierak, Colchester, VT (US); and Kristin Marie Welch, Essex, VT (US)
Assigned to GlobalFoundries U.S. Inc., Malta, NY (US)
Filed by GlobalFoundries U.S. Inc., Malta, NY (US)
Filed on Apr. 11, 2024, as Appl. No. 18/632,902.
Int. Cl. H01L 29/51 (2006.01); H01L 29/20 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01)
CPC H01L 29/404 (2013.01) [H01L 29/2003 (2013.01); H01L 29/401 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A structure comprising:
a dielectric layer; and
a field plate including:
at least three first conductors above and immediately adjacent to the dielectric layer and laterally separated by spaces, wherein at least two of the spaces have different widths;
an additional dielectric layer on the first conductors and within the spaces above the dielectric layer; and
at least one second conductor on the additional dielectric layer, wherein at least two second conductor portions extend into at least two of the spaces, respectively, and, within the at least two of the spaces, the at least two second conductor portions are at different heights above the dielectric layer.