forming a structure including a frame, a semiconductor chip, and a dielectric filling member, the frame including a conductive material and having a mounting space and a plurality of through holes, the semiconductor chip located in the mounting space, and the dielectric filling member filling the mounting space and the plurality of through holes and covering a top surface of the frame;

forming a supporting wiring structure under the structure, the supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure, the first redistribution conductive structure being electrically connected to the semiconductor chip;

forming a plurality of connection structures through the dielectric filling member, the plurality of connection structures extending in the plurality of through holes, electrically connecting the first redistribution conductive structure, and including a material having a higher electrical conductivity than the conductive material of the frame;

forming a cover wiring structure on the structure, the cover wiring structure including a second redistribution dielectric layer and a second redistribution conductive structure; and

attaching an antenna structure including a base board layer and an antenna conductive structure to the cover wiring structure.