US 12,154,870 B2
Semiconductor device package comprising antenna and communication module
Meng-Wei Hsieh, Kaohsiung (TW); and Kuo-Chang Kang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 20, 2021, as Appl. No. 17/556,729.
Application 17/556,729 is a continuation of application No. 16/789,243, filed on Feb. 12, 2020, granted, now 11,205,627.
Prior Publication US 2022/0115341 A1, Apr. 14, 2022
Int. Cl. H01L 23/66 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/768 (2013.01); H01L 23/3731 (2013.01); H01L 24/29 (2013.01); H01L 2223/6677 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a circuit layer;
a first dielectric layer disposed over the circuit layer;
a first antenna pattern disposed between the first dielectric layer and the circuit layer;
a second dielectric layer disposed over the first antenna pattern; and
a second antenna pattern disposed over the circuit layer and at least partially vertically overlapped with the first antenna pattern, wherein a thickness of the second dielectric layer is greater than a thickness of the first dielectric layer, wherein the first dielectric layer is a monolithic structure and has a first width substantially identical to a width of the circuit layer, wherein the second dielectric layer is a monolithic structure and has a second width different from the first width of the first dielectric layer.