	US 12,154,859 B2
	Semiconductor package and method of manufacturing same
Woonchun Kim, Suwon-si (KR); Seungwan Shin, Hwaseong-si (KR); and Gun Lee, Yongin-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 29, 2022, as Appl. No. 17/707,002.
Claims priority of application No. 10-2021-0112491 (KR), filed on Aug. 25, 2021.
Prior Publication US 2023/0067767 A1, Mar. 2, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 25/10 (2006.01)

CPC H01L 23/5386 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/76873 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53238 (2013.01); H01L 23/5383 (2013.01); H01L 25/105 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01)]

20 Claims

1. A semiconductor package, comprising:

a first redistribution structure including first redistribution conductors;

a semiconductor chip on the first redistribution structure and including connection pads electrically connecting the first redistribution conductors;

a connection conductor on the first redistribution structure, laterally spaced apart from the semiconductor chip, and electrically connected to the first redistribution conductors;

an encapsulant on the first redistribution structure and sealing the semiconductor chip and at least a portion of the connection conductor;

a barrier layer extending along an upper surface of the encapsulant; and

a second redistribution conductor on the barrier layer and penetrating the barrier layer to contact the connection conductor.