US 12,154,843 B1
Processors and integrated circuits including a microelectromechanical systems (MEMS) device for cooling
Sridhar Vanka, Bangalore (IN); Prashant Deshpande, Bangalore (IN); Deepak Kumar, Bangalore (IN); Pranita Madke, Bangalore (IN); Ritu Rai, Bangalore (IN); and Prashantha Sv, Bangalore (IN)
Assigned to HONEYWELL INTERNATIONAL INC., Charlotte, NC (US)
Filed by HONEYWELL INTERNATIONAL INC., Charlotte, NC (US)
Filed on Feb. 13, 2024, as Appl. No. 18/440,221.
Application 18/440,221 is a continuation in part of application No. 18/457,562, filed on Aug. 29, 2023, granted, now 11,965,644.
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/467 (2006.01); B81B 3/00 (2006.01); F21V 5/00 (2018.01); F21V 29/508 (2015.01); F21V 29/60 (2015.01); F21W 107/30 (2018.01); F21Y 113/00 (2016.01); F21Y 115/10 (2016.01)
CPC H01L 23/467 (2013.01) [B81B 3/0021 (2013.01); F21V 29/508 (2015.01); F21V 29/60 (2015.01); B81B 2201/036 (2013.01); F21V 5/007 (2013.01); F21W 2107/30 (2018.01); F21Y 2113/00 (2013.01); F21Y 2115/10 (2016.08)] 14 Claims
OG exemplary drawing
 
1. A processing device, comprising:
a processor; and
at least one microelectromechanical systems (MEMS) device coupled to the processor, the at least one MEMS device comprising:
a first arm having a first arm first end and a first arm second end;
a second arm coupled to, and spaced apart from, the first arm, the second arm having a second arm first end and a second arm second end;
at least one permanent magnet coupled to the first arm second end;
a fan structure coupled to, and extending in cantilever manner from, the second arm second end, the fan structure comprising a connection end and a free end, the connection end coupled to the second arm second end, the free end spaced apart from the at least one permanent magnet; and
a coil disposed on or within the fan structure at a location that is at least adjacent the free end,
wherein, when the coil is electrically energized, a Lorentz force is generated that causes the fan structure to vibrate relative to the at least one permanent magnet and relative to the processor, to thereby cool the processor.