US 12,154,836 B2
Semiconductor device with spaced apart containers
Hisashi Tomita, Yokohama Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo (JP)
Filed on Mar. 2, 2022, as Appl. No. 17/685,253.
Claims priority of application No. 2021-154194 (JP), filed on Sep. 22, 2021.
Prior Publication US 2023/0092403 A1, Mar. 23, 2023
Int. Cl. H01L 23/049 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 23/50 (2006.01)
CPC H01L 23/049 (2013.01) [H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first container;
a second container inside the first container;
a semiconductor element inside the second container; and
a chiller outside the first container and configured to inject a refrigerant into a space between the first container and the second container and to discharge the refrigerant from the space, wherein
the second container comprises:
a lower portion;
a side portion fixed to the lower portion, the side portion being a first metal material covered with a first insulator; and
an upper portion fixed to the side portion and the first container, and
the lower portion and the side portion of the second container being spaced from the first container.