US 12,154,819 B2
Wafer cleaning apparatus and method of controlling the same
Seung Dae Baek, Hwaseong-si (KR); Kuem Dong Heo, Ansan-si (KR); Sung Yup Kim, Suwon-si (KR); Jae Hwan Son, Hwaseong-si (KR); Nam Jin Kim, Suwon-si (KR); and Jun Goo Park, Hwaseong-si (KR)
Assigned to ZEUS CO., LTD., Hwaseong-si (KR)
Filed by ZEUS CO., LTD., Hwaseong-si (KR)
Filed on Apr. 12, 2022, as Appl. No. 17/718,982.
Claims priority of application No. 10-2021-0051540 (KR), filed on Apr. 21, 2021; and application No. 10-2021-0051542 (KR), filed on Apr. 21, 2021.
Prior Publication US 2022/0344194 A1, Oct. 27, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); B08B 3/02 (2006.01); B08B 3/12 (2006.01); B08B 13/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6838 (2013.01) [B08B 3/022 (2013.01); B08B 3/12 (2013.01); B08B 13/00 (2013.01); H01L 21/02076 (2013.01); H01L 21/67051 (2013.01); H01L 21/67132 (2013.01); H01L 21/68728 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wafer cleaning apparatus comprising:
a vacuum chuck unit on which a wafer is mounted:
a ring cover unit facing a retainer ring portion of the wafer;
an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens; and
a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.