US 12,154,810 B2
Automated semiconductor substrate polishing and cleaning
ShinBae Park, Cheonan-Si (KR); and SangJun Kim, Cheonan-Si (KR)
Assigned to GlobalWafers Co., Ltd., Hsinchu (TW)
Filed by GlobalWafers Co., Ltd., Hsinchu (TW)
Filed on Jul. 21, 2020, as Appl. No. 16/947,157.
Prior Publication US 2022/0028718 A1, Jan. 27, 2022
Int. Cl. H01L 21/677 (2006.01); B08B 3/04 (2006.01); B08B 13/00 (2006.01); B24B 37/04 (2012.01); B24B 37/08 (2012.01); B25J 15/06 (2006.01); B65G 47/91 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67766 (2013.01) [B08B 3/04 (2013.01); B08B 13/00 (2013.01); B24B 37/042 (2013.01); B25J 15/0616 (2013.01); B65G 47/91 (2013.01); H01L 21/02024 (2013.01); H01L 21/02052 (2013.01); H01L 21/67057 (2013.01); H01L 21/67219 (2013.01); H01L 21/67778 (2013.01); H01L 21/68707 (2013.01); B24B 37/08 (2013.01)] 14 Claims
OG exemplary drawing
 
9. A wafer processing system for processing wafers, the system comprising:
a transfer robot;
a wet bath including a wall and defining a container for retaining a cleaning solution;
a cassette positioned within the wet bath for holding the wafers, wherein the transfer robot transfers the wafers from a transfer location to the cassette;
an automated guided vehicle (AGV) including a robot arm for positioning the cassette in the wet bath and removing the cassette from the wet bath; and
a cassette holder attached to the wall for maintaining a position of the cassette within the wet bath, wherein the AGV positions the cassette within the cassette holder and removes the cassette from the cassette holder, the cassette holder including extensions for engaging the wafers, wherein the cassette holder is rotated after the AGV positions the cassette within the wet bath, the extensions interdigitating between the wafers.