US 12,154,800 B2
Heat treatment apparatus and heat treatment method
Takahiro Kitazawa, Kyoto (JP); Yukio Ono, Kyoto (JP); and Oma Nakajima, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., Kyoto (JP)
Appl. No. 17/777,586
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
PCT Filed Oct. 21, 2020, PCT No. PCT/JP2020/039550
§ 371(c)(1), (2) Date May 17, 2022,
PCT Pub. No. WO2021/131276, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-232583 (JP), filed on Dec. 24, 2019.
Prior Publication US 2023/0018090 A1, Jan. 19, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67115 (2013.01) [H01L 21/67248 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A heat treatment apparatus configured to heat a first substrate and a second substrate by irradiation with a flash of light, the heat treatment apparatus comprising a quantum infrared sensor configured to measure a temperature of the first substrate and a temperature of the second substrate,
wherein a temperature of the first substrate on which first heat treatment having irradiation with the flash of light is performed, the temperature being measured by the quantum infrared sensor, is defined as a reference temperature,
wherein a temperature of the first substrate on which the first heat treatment is performed and then the first heat treatment is performed again, the temperature being measured by the quantum infrared sensor, is defined as a shift temperature, and
the heat treatment apparatus further comprising a temperature correction unit configured to correct, using a correction coefficient calculated based on the reference temperature and the shift temperature, a temperature of the second substrate on which second heat treatment having irradiation with the flash of light is performed, the temperature being measured by the quantum infrared sensor.