US 12,154,721 B2
Multilayer electronic component, and method of manufacturing the same
Young Joon Oh, Suwon-si (KR); and Jeong Ryeol Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 8, 2022, as Appl. No. 17/883,154.
Claims priority of application No. 10-2021-0122733 (KR), filed on Sep. 14, 2021; and application No. 10-2022-0048917 (KR), filed on Apr. 20, 2022.
Prior Publication US 2023/0082454 A1, Mar. 16, 2023
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 35 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including:
a plurality of dielectric layers,
a plurality of internal electrodes,
a capacitance formation portion in which the plurality of dielectric layers and the plurality of internal electrodes are alternately disposed in a first direction,
a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including one of the plurality of dielectric layers, and
a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including one of the plurality of dielectric layers; and
an external electrode disposed on the body,
wherein, among the plurality of internal electrodes, an internal electrode disposed closest to the first cover portion is referred to as IE1, and a ratio of Ni(OH)2 mass to NiO mass in the IE1 is 4.5 or more and 7.5 or less.