US 12,154,715 B2
Methods to selectively embed magnetic materials in substrate and corresponding structures
Cheng Xu, Chandler, AZ (US); Kyu-Oh Lee, Chandler, AZ (US); Junnan Zhao, Gilbert, AZ (US); Rahul Jain, Gilbert, AZ (US); Ji Yong Park, Chandler, AZ (US); Sai Vadlamani, Chandler, AZ (US); and Seo Young Kim, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 26, 2022, as Appl. No. 17/873,518.
Application 17/873,518 is a division of application No. 15/938,119, filed on Mar. 28, 2018.
Prior Publication US 2022/0367104 A1, Nov. 17, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 27/24 (2006.01); H05K 1/18 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/022 (2013.01); H01F 27/24 (2013.01); H05K 1/185 (2013.01); H05K 2201/10 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a printed circuit board (PCB);
a package substrate electrically coupled to the PCB; and
an integrated circuit electrically coupled to the package substrate; and
an inductor integrated into the PCB or the package substrate, wherein the inductor comprises:
an inductor trace; and
a magnetic body surrounding the inductor trace, wherein the magnetic body comprises a stepped surface, and wherein the magnetic body has a first width proximate to the integrated circuit and a second width distal from the integrated circuit, the first width greater than the second width.