US 12,153,823 B2
Multi-level memory programming and readout
Davide Fugazza, San Jose, CA (US); Dany-Sebastien Ly-Gagnon, Santa Clara, CA (US); and DerChang Kau, Cupertino, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 12, 2020, as Appl. No. 17/068,369.
Prior Publication US 2022/0113892 A1, Apr. 14, 2022
Int. Cl. G11C 11/56 (2006.01); G06F 3/06 (2006.01); G11C 13/00 (2006.01); H10N 70/00 (2023.01)
CPC G06F 3/0655 (2013.01) [G06F 3/0604 (2013.01); G06F 3/0679 (2013.01); G11C 11/5678 (2013.01); G11C 13/003 (2013.01); G11C 13/004 (2013.01); G11C 13/0069 (2013.01); G11C 13/0026 (2013.01); G11C 13/0028 (2013.01); G11C 2013/0078 (2013.01); H10N 70/826 (2023.02); H10N 70/882 (2023.02)] 21 Claims
OG exemplary drawing
 
1. A memory device including:
a three dimensional crosspoint memory array comprising memory cells each comprising two terminals and a storage element programmable to one of a plurality of program states each representing distinct values for at least two bits; and
access circuitry to:
apply a first program pulse with a positive polarity across the two terminals of a first memory cell of the memory cells to program the first memory cell to a first program state of the plurality of program states;
apply a second program pulse with a negative polarity across the two terminals of the first memory cell to program the first memory cell to a second program state of the plurality of program states; and
during a read operation, apply a plurality of read voltages having positive polarities and a plurality of read voltages having negative polarities across the two terminals of the first memory cell to determine a program state of the first memory cell.