US 12,153,433 B2
Systems and methods for raised floor automated sensor vehicles
Cheng-Kang Hu, Kaohsiung (TW); Cheng-Hung Chen, Zhubei (TW); Yan-Han Chen, Hsinchu (TW); Feng-Kuang Wu, Hsinchu (TW); Hsu-Shui Liu, Pingjhen (TW); Jiun-Rong Pai, Jhubei (TW); and Shou-Wen Kuo, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 4, 2022, as Appl. No. 17/736,915.
Application 17/736,915 is a continuation of application No. 16/580,977, filed on Sep. 24, 2019, granted, now 11,334,080.
Claims priority of provisional application 62/737,436, filed on Sep. 27, 2018.
Prior Publication US 2022/0261001 A1, Aug. 18, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G05D 1/00 (2024.01); B25J 5/00 (2006.01); G01S 17/931 (2020.01)
CPC G05D 1/0214 (2013.01) [B25J 5/007 (2013.01); G01S 17/931 (2020.01); G05D 1/0088 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
an automated vehicle configured to traverse on a raised floorboard platform; and
at least one sensor located on the automated vehicle, the at least one sensor configured to detect a defect on the raised floorboard platform ahead of the automated vehicle, wherein the automated vehicle is configured to change its direction of travel in response to detecting the defect on the raised floorboard platform,
wherein the automated vehicle is configured to travel from a first semiconductor processing station to a second semiconductor processing station along the raised floorboard platform.