US 12,153,325 B2
Wavelength converter
Nobutatsu Koshobu, Musashino (JP); Koji Embutsu, Musashino (JP); Takeshi Umeki, Musashino (JP); Osamu Tadanaga, Musashino (JP); Takahiro Kashiwazaki, Musashino (JP); Takushi Kazama, Musashino (JP); and Asuka Inoue, Musashino (JP)
Assigned to Nippon Telegraph and Telephone Corporation, Tokyo (JP)
Appl. No. 17/919,965
Filed by Nippon Telegraph and Telephone Corporation, Tokyo (JP)
PCT Filed Apr. 22, 2020, PCT No. PCT/JP2020/017284
§ 371(c)(1), (2) Date Oct. 19, 2022,
PCT Pub. No. WO2021/214897, PCT Pub. Date Oct. 28, 2021.
Prior Publication US 2023/0185157 A1, Jun. 15, 2023
Int. Cl. G02F 1/35 (2006.01); G02F 1/383 (2006.01); H10N 10/13 (2023.01)
CPC G02F 1/3505 (2021.01) [G02F 1/383 (2013.01); H10N 10/13 (2023.02); G02F 1/3503 (2021.01)] 7 Claims
OG exemplary drawing
 
1. A wavelength converter configured to generate light with a wavelength different from a wavelength of a signal light when the signal light is input, the wavelength converter comprising:
a wavelength conversion element including a substrate as a base with a light waveguide core at a first main surface, the substrate having a lower refractive index for the signal light than the light waveguide core, the wavelength conversion element being configured to convert the wavelength of the signal light;
a temperature control element joined to a portion excluding both of one end portion and another end portion in a second main surface of the substrate, and configured to support the wavelength conversion element and control a temperature of the wavelength conversion element;
a support structure configured to support the wavelength conversion element through a contact at a tip end surface at a position corresponding to at least one end portion of the light waveguide core in the second main surface of the substrate at occurrence of elastic deformation due to a thermal stress during wavelength conversion of the wavelength conversion element; and
a metal housing bottom surface member disposed at a bottom surface inside a metal housing configured to house the wavelength conversion element, the metal housing bottom surface member being a member where the support structure is provided,
wherein the support structure is provided at a portion apart from the temperature control element at a top surface of the metal housing bottom surface member, and the tip end surface is disposed in a vicinity of the position in the second main surface of the substrate,
wherein the support structure includes a temperature control mechanism configured to perform a temperature control of the wavelength conversion element from a side of the second main surface of the substrate.