US 12,153,268 B2
Technologies for increased volumetric and functional efficiencies of optical packages
Scott D. Morrison, Austin, TX (US); Bilal Mohamed Ibrahim Kani, Singapore (SG); Kishore N. Renjan, Singapore (SG); Kyusang Kim, Singapore (SG); Lan H. Hoang, Los Gatos, CA (US); and Manoj Vadeentavida, Singapore (SG)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jan. 3, 2022, as Appl. No. 17/646,784.
Prior Publication US 2023/0213715 A1, Jul. 6, 2023
Int. Cl. G02B 6/42 (2006.01); F21V 8/00 (2006.01)
CPC G02B 6/428 (2013.01) [G02B 6/0028 (2013.01); G02B 6/0065 (2013.01); G02B 6/0081 (2013.01); G02B 6/4283 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An optical package comprising:
a back side routing layer including a top side and bottom side;
a printed circuit board (PCB) core on the top side of the back side routing layer, the PCB core including a plurality of vertical vias and a first cavity;
an optical component mounted within the first cavity, wherein a top side of the optical component includes a guard fence surrounding an optical surface;
an insulating material encapsulating the optical component within the first cavity, wherein the insulating material does not penetrate inside the guard fence; and
a front side routing layer on top of the PCB core and the optical component, wherein the front side routing layer includes a transparent dielectric layer spanning over the optical component.