a first optical element having a first dielectric bonding surface, a first plurality of contact pads, a plurality of pixels having at least a first pixel and a second pixel, and a first array of optical emitters configured to emit light of a first color, the first array of optical emitters having at least a first optical emitter and a second optical emitter, wherein the first pixel comprises light emitted from the first optical emitter and the second pixel comprises light emitted from the second optical emitter, and at least one optical isolation structure disposed between the first pixel and the second pixel; and

at least one processor element comprising a second dielectric bonding surface, a second plurality of contact pads, and active circuitry configured to control operation of an individual optical emitter of the first array of optical emitters,

wherein the first and second dielectric bonding surfaces are directly bonded without an intervening adhesive and the first and second plurality of contact pads are directly bonded and electrically connected to one another without an intervening adhesive.