CPC G01B 9/02051 (2013.01) [B81B 3/00 (2013.01); B81B 3/0021 (2013.01); B81B 3/007 (2013.01); G01B 9/02049 (2013.01); G01J 3/0202 (2013.01); G01J 3/021 (2013.01); G01J 3/0237 (2013.01); G01J 3/108 (2013.01); G01J 3/14 (2013.01); G01J 3/45 (2013.01); G02B 7/182 (2013.01); G02B 26/0816 (2013.01); G02B 26/0833 (2013.01); G02B 26/0841 (2013.01); G02B 27/144 (2013.01); B81B 2201/042 (2013.01); B81B 2203/0154 (2013.01); G01B 2290/25 (2013.01); G01B 2290/35 (2013.01); G01J 2003/104 (2013.01); G01J 3/4532 (2013.01); G01J 3/4535 (2013.01)] | 4 Claims |
1. A method for manufacturing a mirror unit comprising:
a mirror device that includes a base including a first surface and a second surface opposite to the first surface, and a movable mirror supported in the base to be movable along a first direction that intersects the first surface;
a first member joined to the first surface of the base; and
a second member joined to the second surface of the base;
wherein at least the movable mirror is disposed in an air-tight space formed by the base, the first member, and the second member,
the method comprising:
a first process of preparing a first wafer including a plurality of portions each becoming the first member, a second wafer including a plurality of portions each becoming the second member, and a third wafer including a plurality of portions each becoming the mirror device, joining the first wafer and the third wafer to each other in such a manner that one piece of the first member and one piece of the mirror device correspond to each other, and joining the second wafer and the third wafer to each other in such a manner that one piece of the second member and one piece of the mirror device correspond to each other, and
a second process of cutting the first wafer, the second wafer, and the third wafer including a plurality of portions each becoming the mirror unit and joined to each other into a plurality of mirror units after the first process.
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