US 12,152,169 B2
Adhesive conductive paste
Takanori Kobatake, Tokyo (JP); Tomoya Egawa, Tokyo (JP); and Yasuyuki Akai, Tokyo (JP)
Assigned to DAICEL CORPORATION, Osaka (JP)
Appl. No. 17/632,880
Filed by DAICEL CORPORATION, Osaka (JP)
PCT Filed Aug. 4, 2020, PCT No. PCT/JP2020/029758
§ 371(c)(1), (2) Date Feb. 4, 2022,
PCT Pub. No. WO2021/025003, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 2019-145510 (JP), filed on Aug. 7, 2019.
Prior Publication US 2022/0275247 A1, Sep. 1, 2022
Int. Cl. C09J 1/00 (2006.01); C09J 9/02 (2006.01); C09J 11/06 (2006.01)
CPC C09J 1/00 (2013.01) [C09J 9/02 (2013.01); C09J 11/06 (2013.01); C09J 2203/326 (2013.01)] 8 Claims
 
1. An adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect an electronic element, the adhesive conductive paste comprising a conductive particle and a solvent,
wherein the conductive particle comprises a silver particle (A) having an average particle size of 1 nm or more and less than 100 nm, and a silver particle (B) having an average particle size of 0.1 μm or greater and 10 μm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine,
wherein the solvent comprises a compound (C) that is represented by Formula (I):
Ra—O—(X—O)n—Rb  (I)
where in Formula (I), Ra represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, Rb represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, Ra and Rb may be the same, and n represents an integer from 1 to 3, and
wherein a content of an organic component is 15 wt. % or less relative to 100 wt. % of the adhesive conductive paste.